COVID-19 updates:

University of Waterloo Coronavirus Information website

See list of Faculty of Engineering Modified Services

The Giga-to-Nanoelectronics Centre has reopened for research activities, as of August 17 2020.  Researchers wishing to use the facilities are required to review the new and additional safety material listed in the link at the left side of this page.

Kulicke and soffa Model 4123 universal wire bonder

Kulicke and soffa wire bonderThe Kulicke and soffa wire bonder uses heat and ultrasonic (‘thermosonic’) energy to stitch connecting wires between suitable bond points on semiconductor circuits or between bond points and external contacts such as package leads.


  1. 95 mm x 95 mm access for bonding area.
  2. capable of bonding Au wire (12.7-76.2 microns)
  3. capable of bonding Al wire (25.4-101.6 microns)

View the cost of using the Kulicke and soffa wire bonder.

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