PlasmaTherm 790 series plasma-enhanced chemical vapor deposition (PECVD)

PlasmaTherm (790 series) is a 13.56MHz plasma-enhanced chemical vapor deposition (PECVD) system. This system is normally used for deposition of low temperature (less than 350oC) films of silicon nitride, silicon oxide, and amorphous and nanocrystalline silicon.

Currently, the following gas lines are connected to the system: SiH4, NH3, N2O, He, H2, PH3, TMB (B(CH3)3), and CH4. For deposition of doped silicon films, PH3 and TMB are used for n-type and p-type doping, respectively.

The system is single-chamber equipment with electrode area of 14"x14".

Find out the costs to using the Plasmatherm plasma-enhanced chemical vapor deposition (PECVD).

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