MAL-02: Metal Deposition Semiconductor Process Tool

Brief description of the organization

MicroAlchemy is a semiconductor manufacturing company that is also distributing electronic design automation (EDA/CAD) tools. We are a manufacturing company that is focused on chip prototyping and open source tooling.


Problem area

Metal interconnects and contacts are a key aspect of semiconductor manufacturing. A variety of techniques are used for metal deposition on silicon wafers.


Main objectives

The main objective is to develop a metal deposition tool to deposit Copper or Aluminum across a 100mm silicon wafer in a uniform layer. Key performance metrics would be a well-characterized process to determine deposition thickness and uniformity over the wafer and conductance/resistance.


Scope of work

  • Literature review of deposition techniques e.g. hackerfab.
  • Planning of the electrical and mechanical portions. Building a prototype of the metal deposition tool.
  • Characterization of the results using the prototype.

Deliverables

  • Report
  • Presentation
  • New protocols/processes

Team meeting frequency

Weekly


Skills and training required

  • Research and analytical skills
  • Presentation skills
  • Electrical and mechanical prototyping skills
  • Metrology and characterization techniques.

Resources required

  • Some specialized tools/equipment, e.g. SEM (will be provided at our office under our supervision).
  • Prototyping tools like breadboarding/solder/perfboard.
  • Other mechanical or electrical equipment is available in school labs or our office.

NDA or a commercialization agreement for this project?

Yes