Vendor: Yield Engineering Systems

Model: CV200RFS

Purpose: Photoresist strip and descum

Equipment wiki link

Equipment description:

The YES-CV200RFS is a downstream plasma tool designed to effectively remove photoresists and polymers at up to 700 nm/min on different sample sizes, from pieces up to 8″ wafers. For more information about available processes and disallowed processes please consult the equipment wiki page.

System features and options:

  • Substrate up to 8″ in diameter
  • Heated chuck up to 250℃
  • Downstream RF plasma up to 1000 W