Vendor: Yield Engineering Systems
Purpose: Photoresist strip and descum
The YES-CV200RFS is a downstream plasma tool designed to effectively remove photoresists and polymers at up to 700 nm/min on different sample sizes, from pieces up to 8″ wafers. For more information about available processes and disallowed processes please consult the equipment wiki page.
System features and options:
- Substrate up to 8″ in diameter
- Heated chuck up to 250℃
- Downstream RF plasma up to 1000 W