Professor, Chemical Engineering

Research interests: PECVD; porous ultra-low-dielectric constant materials; nano-mechanics; thin film mechanical properties; nanoindentation​


After completed his doctoral degree from Rice University, Houston, Texas, Professor Ting Tsui joined Advanced Micro Devices (AMD) as a Senior Materials Engineer to study mechanical reliability of copper/low-k technology for the integrated circuits. His interests in processing technology landed him a position at the Texas Instruments Inc. (TI). At TI, Tsui developed low-k thin films for Plasma Enhanced Chemical Vapor Deposited (PECVD) interlayer dielectric and dielectric barriers for 90 nm, 65 nm, and 45 nm technology node. He is also interested in the small scale mechanical aspect of these materials, such as thin film channel cracking and delamination. In 2007, Tsui began his appointment at the University of Waterloo and research in the areas of porous ultra-low-dielectric constant materials, nano-mechanics, thin film mechanical properties, and nanoindentaion. 


  • PhD, Materials Science, Rice University, Houston, Texas, 1997
  • MASc, Materials Science, Rice University, Houston, Texas, 1992
  • BASc, Ceramic Engineering, Clemson University, South Carolina, 1990

Ting Tsui

    University of Waterloo