MASc student research seminar: room-temperature bonding with Pd coated Cu wire on Al pads: ball bond optimization with 2-stage methodology
Biography: Nickolas Kam completed his undergrad at the University of Waterloo in mechanical engineering. He is now pursuing his master's as a member of the CAMJ lab group, working primarily in electronic packaging and wirebonding technology.

The proliferation of AI has placed increased focus on the thorny topic of ethics: to what extent are engineers responsible for—and to what extent can they encode—the ethical behavior of the AI applications they design?

The Problem Lab invites you to watch the Quantum Valley Investments® Problem Pitch Competition.

