News

The University of Waterloo is partnering Tsinghua University in Beijing, China on a research collaboration centre that will advance science in the areas of nanotechnology, energy, and pollution control.

The centre—known as Tsinghua University – University of Waterloo Joint Research Centre for Micro/Nano Energy & Environment Technology—officially opened on March 29.

Mary Wells wins Engineers Canada award for encouraging young women to consider careers in engineering.

Waterloo Engineering’s Associate Dean of Outreach has received a national award from Engineers Canada for expanding outreach activities that encourage young women to consider a career in engineering.

2016 Canadian Engineering Competition - Compétition Canadienne D'ingénierie

The 2016 Canadian Engineering Competition took place at McGill University on March 3^rd-6^th.

Professor Kyle Daun has been awarded a Humboldt Research Fellowship. This is a monetary award given to an outstanding academic to continue his/her research in Germany for a period of up to 18 months.

John McPhee, a systems design engineering professor, and Willem Petersen, a systems design engineering postdoc, captured one of two best paper awards at the recent ASME (American Society of Mechanical Engineers) International Conference on Advanced Vehicle Technologies held in Portland Oregon.

Ibraheem Khan (MASc, PhD, mechanical) presented his Waterloo Engineering research on shape memory alloys during his keynote address at the Medical Manufacturing Innovations Conference held in Toronto at the end of October. Khan's doctoral thesis was on the discovery of Multiple Memory Material Technology for which he and Norman Zhou, a mechanical and mechatronics engineering professor, are co-inventors. Kahn is currently president and CTO of Smarter Alloys and a research associate at the University of Waterloo's Centre for Advanced Materials Joining.

The Globe and Mail featured an article on collaboration between Microbonds Inc. of Markham, Ontario, and MME professors Norman Zhou and Michael Mayer. This collaboration focused on developing innovative ways to lower the production costs of the company’s semiconductor packaging business without having to overhaul operations or lose ground in its sector.