2016 Canadian Engineering Competition - Compétition Canadienne D'ingénierieThe 2016 Canadian Engineering Competition took place at McGill University on March 3rd-6th.
Carolyn Hansson is named as a new Member of the 
Order of Canada for her contributions as a materials engineer whose efforts have reduced corrosion and improved the performance of reinforced concrete structures.
Mechanical and Mechatronics Engineering's very own graduate student, Elahe Jabari, has been chosen as one of the top ten University of Waterloo finalists for the Three Minute Thesis (3MT) Competition.
We encourage everyone to cheer on Elahe during the final competition which will be held on Thursday, April 2, from 2:30 until 4:30 p.m. in the Humanities Theatre, Hagey Hall.
For more information on the 3MT Competition please visit their main website.
Professor Kyle Daun has been awarded a Humboldt Research Fellowship. This is a monetary award given to an outstanding academic to continue his/her research in Germany for a period of up to 18 months.
John McPhee, a systems design engineering professor, and Willem Petersen, a systems design engineering postdoc, captured one of two best paper awards at the recent ASME (American Society of Mechanical Engineers) International Conference on Advanced Vehicle Technologies held in Portland Oregon.
Ibraheem Khan (MASc, PhD, mechanical) presented his Waterloo Engineering research on shape memory alloys during his keynote address at the Medical Manufacturing Innovations Conference held in Toronto at the end of October. Khan's doctoral thesis was on the discovery of Multiple Memory Material Technology for which he and Norman Zhou, a mechanical and mechatronics engineering professor, are co-inventors. Kahn is currently president and CTO of Smarter Alloys and a research associate at the University of Waterloo's Centre for Advanced Materials Joining.
The Globe and Mail featured an article on collaboration between Microbonds Inc. of Markham, Ontario, and MME professors Norman Zhou and Michael Mayer. This collaboration focused on developing innovative ways to lower the production costs of the company’s semiconductor packaging business without having to overhaul operations or lose ground in its sector.